Introduction

Compression interconnect technology, which is used to connect two parallel surfaces, is very important in demanding high-speed applications in the computer, telecommunications and aerospace markets. Cinch’s compression interconnect technology is solderless and utilizes compression style hardware to align and hold the components together. Cinch offers two connector technologies to meet the most challenging interconnect needs: CIN::APSE^®, a unique wound contact and Cinch iQ™, a patented stamped metal contact.

Cinch Compression Products

Click on one of the following products for additional information:

• CIN::APSE^®
• IQ^®
• IQ^® Hybrid
• IQ^® Flex