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Introduction
It takes more than an ordinary connector to support advanced performance interconnect applications. It takes CIN::APSE, a proven solderless Z-axis connector technology that offers exceptional mechanical and electrical performance at signals well above 20 GHz.
If you have an interconnect challenge, and need to overcome the restrictions of ordinary connector devices, CIN::APSE can provide the versatile and reliable interconnect solution you need.
Innovative Compression-Mount Technology
CIN::APSE is a unique, Z-Axis compression interconnect which provides superior mechanical and electrical performance. The contact construction consists of randomly wound gold plated molybdenum wire, formed into a cylindrical shape (Figure 1). Standard contact diameters are 0.020″ (0.508 mm) and 0.040″ (1.016 mm).
The basic CIN::APSE contact configuration consists of a contact installed into a customized plastic insulator with the patented Cinch hourglass hole design. Once in place, the contact extends on both sides of the insulator.
Quick, Solderless Installation
CIN::APSE is easily installed in two basic steps, without soldering. First, using alignment features, the CIN::APSE interconnect is positioned between two components with matching connection footprints. Next, the two components are compressed and fastened together. It’s as simple as that.
Low Compression Force, Low Contact Resistance
The CIN::APSE contact offers one of the best force/deflection ratios in the industry. An average compression force of only 2.5 ounces will yield a typical contact resistance of less than 20 mOhms. This means high I/O count applications can achieve excellent electrical performance with only minimal Z-Axis compression force.
*Test results are pass/fail criteria, not limitations of the technology.
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Features
High signal speed capability enabling frequencies greater than 20 GHz.
- Z-Axis, solderless, compression mount interconnect system.
- Applications include production Land Grid Array (LGA) integrated circuit sockets and parallel PCB to PCB interconnections.
- Provides solutions to many of the problems associated with through hole and surface mount soldered technology.
- Enables upgrade and system maintenance strategies.
- Available in custom I/O configurations and I/O counts from 1 to over 7,000.
- Offers low profile capabilities with compressed signal path length as short as 0.8 mm.
- Contact centerline spacing of 1mm or greater.
- Excellent reliability in commercial, military, and aerospace applications.
- Application can result in lower installed and system maintenance costs.
Materials
- Contact Material: Molybdenum
- CIN::APSE Contact Plating: Gold
- Plunger Material: Copper alloy
- Plunger Plating: Gold
- Insulator Material: Liquid crystal polymer
- Packaging Tray Material: Anti-static ABS
Mechanical
- Contact-Only Configuration with 0.020″ (0.5 mm) diameter
- Durability: 25,000 Z-axis actuations (CIN::APSE contact only)
- Shock:100 Gs; 6 milliseconds; no discontinuity greater than 2 nanoseconds
- Vibration:20 Gs; 10-2,000 Hz; no discontinuity greater than 2 nanoseconds
Electrical
- Contact-Only Configuration with 0.020″ (0.5 mm) Diameter
- DC Resistance: Less than 15mOhm
- Inductance: Less than 0.5 nH
- Current-Carrying Capability: 3 - 6 Amps
- Insulation Resistance: > 1000 MOhm @ 500 VDC
- Dielectric Withstanding Voltage: 500 VDC at sea level
Environmental
- Contact-Only Configuration with 0.020″ (0.5 mm) Diameter
- Temperature Life Testing: 1000 Hours @ 200°C; 5000 Hours @ 170°C
- Thermal Shock: 100 Cycles @ -55°C to +85°C; 2,000 cycles @ -20°C to +110°C
- Humidity: 5,000 Hours @ 30°C to 80°C @ 85% RH
- Salt Spray: 96 Hours
- Low Temperature: Operates in liquid nitrogen (-200°C)
- Bellcore TR-NWT-001217: Passed with plungers
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Configurations
Contact Only
This CIN::APSE basic configuration provides multiple points of contact and mechanical wipe. Ideally suited for applications requiring high speed, low profile, and high density, this configuration is commonly used in LGA sockets.
Plunger-Contact
The addition of a gold-plated brass plunger increases the handling durability of the CIN::APSE contacts and provides additional height. This configuration is ideally suited for board-to-board and test applications.
Plunger-Contact-Plunger
Adding a second plunger to the connector results in a tall system (up to 1.0″), along with it being the most durable in terms of handling. This configuration is best suited for contacts that see excessive handling from both sides. Commonly used for parallel board-to-board stacking connector applications.
Contact-Spacer-Contact
Using two contacts with a gold-plated brass spacer in between creates a connector with all the benefits of the contact-only style, and the ability to span greater z-axis heights (up to 1.0″). This configuration is most often used when multiple points of contact are needed in a tall connector.
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Design Guidelines
When designing your system with CIN::APSE, keep the following in mind:
- Ensure that mated height stays within specified range.
- Gold interfaces are needed on contact surfaces being mated.
- Compression range must be controlled within specified range.
- A compression system is typically required.
- The operating environment (temperature) must be compatible with the contact and insulator material.
Here are some basic guidlines to follow when laying out your PCB, flex circuit, chip package or MCM to work with the CIN::APSE contacts.
General configuration Guidelines
- Pad Plating: Au over Ni
- In-Pad Vias: less than half the diameter of the button (for contact-only configurations)
- PCB/Chip flatness per side: 0.003″
- Pad true position: Typically 0.010″
Specific Configuration Guidelines
| Characteristics |
Contact Only 0.020″ dia |
Contact Plunger |
Plunger Contact Plunger |
Contact Spacer Contact |
Contact Only .040″ dia |
| Pad Size (+/- .001″) |
0.027″ |
0.027″ |
0.020″ |
0.027″ |
0.054″ |
| Min. Center-Spacing |
0.040″ |
0.050″ |
0.050″ |
0.050″ |
0.070″ |
| Min. Compression Force/button |
2.5 oz |
2.5 oz |
2.5 oz |
2.5 oz |
4 oz |
| Working Compression Range |
0-0.006″ |
0-0.006″ |
0-0.006″ |
0-0.010″ |
0-0.008″ |
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Typical Applications
- Board-to-Board
- Component-to-Board
- Chip-to-Board
- Flex-to-Board
CIN::APSE can be used to interconnect virtually any gold-plated surface (pad) to another pad. It is the ideal interconnect solution for applications in which high reliability, high-speed signals, tight envelope dimensions, high density, and extreme environmental conditions need to be met.
Explore the Potential of CIN::APSE in your Application
The more you know about CIN::APSE, the more you realize its advantages and suitability in virtually any advanced performance interconnect application.
CIN::APSE has a demonstrated record of reliable performance as the interconnect technology powering many of today’s most advanced computer applications. CIN::APSE also provides the same board-to-board advantages for high-speed telecom, stringent military and aerospace, and demanding automotive applications.
To discuss your ideas for current or future applications, contact CIN::APSE Marketing department at 1-800-323-9612 or e-mail directly to cinapse@cinch.com.
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Typical Compression Systems
LGA Compression System Elements:
- Bolster plate: for support and planarity
- Springs (ground ended with known spring rate): to assure a uniform load and distribution
- Threaded hardware with controlled stop: provides pre-established compression to the springs and transfers load to the system
CIN::APSE applications typically require a compression system, which uniformly distributes force throughout the connector, and ensures adequate planarity
Compression systems can range from simple fasteners or screws to more sophisticated systems as the I/O count increases.
Cinch has years of experience in designing compressionsystems for CIN::APSE applications. Contact us to help optimize a compression system to meet your specific application.
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