Cinch iQ® | Cinch Connectors

Cinch iQ^®

Introduction | Features | Design Guidelines | Typical Applications | Typical Compression Systems

Introduction

iQ Technology

The patented Cinch iQ^® solderless compression interconnect technology provides superior electrical and mechanical performance to satisfy the most demanding interconnect requirements. The key to this highly innovative technology is the iQ contact. The unique design provides superior performance in a low profile, reduced force design. The “Q” shaped contact provides a top to bottom shorting path when compressed that results in an industry leading shortest electrical length. This minimal contact length provides very low inductance and crosstalk, which makes iQ an excellent solution for very high speed, Gigabit-level applications. The iQ contacts float in the insulator, which supports uneven board planarities in a highly compliant design. The gold plated copper alloy contacts are secured in a plastic insulator that is configured to the exact requirements of your application.

Real versatility

Cinch’s iQ technology is designed for versatility. Its excellent mechanical and electrical characteristics give it advantages for challenging high-speed CPU/ASIC-to-board designs. Its robust interface and ability to support high I/O and high-density configurations are an inherent match for high-speed flex applications where reliability, flexibility, and low profile characteristics are critical.

For board-to-board applications, a low profile and reasonable mating tolerances are key. In both areas, Cinch’s iQ technology is well suited, and the low compression forces and high-speed capabilities are especially important for component-to-board applications.

Impressive features

The new Cinch iQ technology brings impressive features to a variety of interconnect applications. The 0.032 in (0.81mm) profile results in short signal paths with low self-inductance (less than 0.6 nH) and low resistance (below 12 mOhm). A short signal path minimizes cross-talk, resulting in a NEXT of 1.3 to 4%. Low compression force reduces stress on mating components, and high-density pin out as low as 1.0 mm saves board space while working with large arrays. The large working range accommodates greater system non-planarities. In addition, the unique floating contacts shift to adjust for uneven planarities, allowing greater tolerances for all applications.

Availability

Cinch iQ technology-based products are available now. Cinch’s experienced engineers are already working closely with customers to design the new technology into each of their unique applications.

Features

Materials

Contact Material: High performance copper alloy
iQ Contact Plating: Gold
Insulator Material: Liquid crystal polymer
Packaging Tray Material: Anti-stat Plastic

Mechanical

Durability: 50 cycles
Shock: 50 Gs; 11 milliseconds, 1/2 sine, 3 per axis
Vibration: Random, 5-1000 Hz; 4.8G, 45 minutes/axis, 3 axis total

Electrical

DC Resistance: 20mOhm max. initial. ?R=10mOhm max per contact
Inductance: Less than 0.65 nH
Current-Carrying Capability: 3×3 array=2.66A, 2×2 array=3.22 A
NEXT: 1.3-4.0%
Insertion Loss: 0.96db @ 20 GHz
Insulation Resistance: 1,000 MOhm @ 500 VDC
Dielectric Withstanding Voltage: 500 VDC, 1 minute hold

Environmental

Temperature Life Testing: 2000 Hours @ 100°C
Thermal Shock: 10 Cycles @ -55°C to 105°C
Temperature-Humidity cycling: 504 Hours @ 25°C to 85°C, 80% RH

Design Guidelines

When designing your system with Cinch iQ, keep the following in mind:

Ensure that mated height stays within specified range.
Gold interfaces are needed on contact surfaces being mated.
Compression range must be controlled within specified range.
A compression system is typically required.
The operating environment (temperature) must be compatible with the contact and insulator material.

Here are some basic guidelines to follow when laying out your PCB, flex circuit, chip package or MCM to work with the iQ contacts.

Configuration Guidelines

PCB pad plating: Au over Ni
PCB in-pad vias: up to 0.011″ diameter
PCB/Chip flatness per side: up to 0.005″
PCB/Chip pad true position: no more than 0.008″
PCB pad size: 0.026″ (+/- 0.002″)
Chip pad size: 0.028″ (+/- 0.002″)
Minimum center spacing: 0.039″
Compression force/contact: 62 grams average
Contact elastic range: 0.0175″ (0.44 mm)

Typical Applications

Board-to-board
Component-to-board
Chip-to-board
Flex-to-board

Cinch iQ can be used to interconnect virtually any two gold-plated surfaces. It is a smart interconnect solution for applications that need high-speed signals, high density, durability, and high compliance.

Real Versatility

Cinch iQ can be used in advanced computer applications, high-speed telecom applications, medical electronics, test equipment, and other demanding applications.

To discuss your ideas for current or future applications, contact the Cinch iQ Marketing department at 1-800-323-9612 or e-mail directly to iQ@cinch.com.

Typical Compression Systems

LGA Compression System Elements:

Bolster plate: for support and planarity
Springs (ground ended with known spring rate): to assure a uniform load and distribution
Threaded hardware with controlled stop: provides pre-established compression to the springs and transfers load to the system

Cinch iQ applications typically require a compression system, which uniformly distributes force throughout the connector, and ensures adequate planarity. Compression systems can range from simple fasteners or screws to more sophisticated systems as the I/O count increases. Contact us to help optimize a compression system to meet your specific application.