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Introduction | Features

Introduction

iQ^®Hybrid, is a revolutionary high performance interconnect that provides a high performance, high density compression style connector in a standard solderable and RoHS compliant design.

The design represents the next advancement for Cinch in their longstanding leadership in compression style connectivity. The unique contact features a shorting path when compressed that produces the shortest electrical path for the highest bandwidth performance. And by designing it to be solderable, it can be used on a standard circuit board without the need for a hard gold pad interface.

The product can be used as a socket for processor and ASIC chips, offering the advantage of field replacement of chips in a standard solderable solution. The product can also be used to connect two boards directly, to connect a device such as a fiber optic transceiver to a board, or to connect flex cabling to a board.

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Features

Materials

• iQ Hybrid Contact Base Material: High Performance Copper Alloy
• iQ Hybrid Contact Plating: Gold (Optimal for Surface Mount Attachment)
• Insulator Material: Liquid Crystal Polymer
• Cover Material: Liquid Crystal Polymer
• JEDEC-style Packaging Tray: ABS with ESD 10e+05-10e+12 Ohms/Sq.

Mechanical

• Durability: 25 Cycles Min.
• Shock: 50 G Peak; 11 milliseconds, Half-sine, 3 Shocks per Axis
• Vibration: Random, 20-500Hz, 2.8G RMS, 1.5 Hours/Axis Total
  *Mechanical Data are Expected Values

Electrical

• DC Resistance: 25mOhm max. initial. ?R=10mOhm max per contact
• Inductance: Less than 1 nH
• Current-Carrying Capability: Min. of 1.0 A
• NEXT: Less than 5% of Overall Signal
• Insulation Resistance: 1,000 MOhm @ 500 VDC
• Dielectric Withstanding Voltage: 500 VDC, 1 minute hold
  *Electrical Data are Expected Values

Environmental

• Temperature Life Testing: 2000 Hours @ 100°C
• Thermal Shock: 10 Cycles @ -40°C to 60°C
• Accelerated Temperature Cycling (ATC): 2500 Cycles @ 0°C to 70°C

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