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Introduction | Technology | Key Benefits | Experience | Configurations, Uses and Applications

Click here for CIN::APSE for Electronic & Communication Systems

Introduction

Astounding performance and unsurpassed reliability make CIN::APSE the interconnect of choice for the most demanding Military and Aerospace applications.

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Technology

CIN::APSE is a proven solderless compression connector technology that offers exceptional mechanical and
electrical performance. At the heart of the technology is a unique all metal contact formed from a single gold-plated molybdenum wire. This reliable contact delivers unmatched mechanical and electrical benefits in a wide variety of applications.

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Key Benefits for Military & Aerospace Applications:

• Solderless RoHS compatible
• High density/low profile
• Multi-point contact/mechanical wipe
• Minimum contact spacing of 1.0mm (.039)
• Low profile height of .8mm (.032)
• High frequency capability up to 50 GHz and beyond
• Short signal path allows for minimal FEXT/NEXT

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CIN::APSE Experience

Over 10 years in a wide variety of Military and Aerospace connector applications on platforms such as:

• Aircraft
  • F-15
  • F/A-18
  • GRIPEN
  • Comanche Helicopter
  • Commercial Aircraft
• Smart Munitions
  • Stinger Missile
  • Small Diameter Bomb
  • Maverick
• Space Applications
  • Iridium Satellite
  • ULE Module for Spacecraft

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Configurations, Uses and Applications

Versatile Configurations

In addition to standard configurations, CIN::APSE can be
custom configured to meet your exact footprint and mated heights.

• Quick-Turn Machined Prototypes
• Heights Ranging from .020″ - 1.5″
• Multiple Insulator Materials to Fit Needs of Applications
• Compression System Design Available

Common Uses

CIN::APSE can be used in almost any application where you need to connect two parallel surfaces.
Common uses include:

• Board to Board
• Chip Package/Module to board
• Flex to Board
• Component to Board

Common Applications

• High Speed RF Solutions
  • Satellite Antennas
  • Phased Array Antennas
  • Active Electronically Steered Array Radar
• Smart Munitions
  • Missiles
  • Small Diameter Munitions
• Airborne Computers and Avionics
  • MCM’s, ASIC’s, CPU’s
  • LRM’s
  • Gyros

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