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Low Profile Board-to-Board Connectors
- posted: 2004-11-03 -
November 3, 2004 - Cinch Connectors today announced the introduction of its Low Profile Board-to-Board Connectors.
Designed for applications requiring low profile, compact footprint interconnects between printed circuit boards or components, the Connectors offer a low mated height of 0.81mm in custom, flexible footprint configurations with contact spacing as close as 1.0mm. In addition, the connectors provide excellent high speed performance, easily supporting signal speeds in excess of 20 Ghz with contact resistance less than 25 m.
The Low Profile Connectors utilize proven CIN::APSE contact technology, a unique solderless wound-wire contact with field-proven reliability in demanding applications ranging from high end computer servers to military jet aircraft.
Available in contact counts ranging from less than 10 contacts to over 2,000, the Connectors can be custom configured in patterns of arrays or individual contacts depending on the unique demands of an application.
The unique combination of mechanical and electrical features makes the Low Profile Connectors an ideal choice for RF Board-to-Board assemblies, Low-Profile Mezzanine Boards, and High-Performance Component-to-Board assemblies in Computer, Communications and Medical Electronics market applications.
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