Stacking & Compression

High-performance, solderless Z-axis interconnects with a compression-mount design for reliable, high-density connections and signal speeds beyond 50 GHz.

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Stacking Connectors
Illustration of two stacking connector hardware products

Stacking Connector Hardware
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Stacking Connector Jumpers and Assemblies

Solderless Compression Connector Technology

  • Solderless Compression Design
    Simplifies assembly and maintenance while minimizing thermal stress on components.
  • High-Density, Configurable Layouts
    Supports various contact counts and pitches to meet diverse application needs.
  • Reliable High-Speed Performance
    Delivers low contact resistance, high current capacity, and excellent signal integrity beyond 50 GHz.
  • Durable in Harsh Environments
    Withstands extreme shock (100 Gs) and vibration (20 Gs) for mission-critical reliability.
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Discover CIN::APSE®

CIN::APSE crimpless, solderless compression technology delivers high-speed, reliable performance in mission-critical applications, powering next-gen systems in aerospace, defense, space, and precision test equipment where durability, density, and signal integrity are essential.

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